KAGA FEI has expanded its wireless module line-up with new modules supporting Bluetooth 6 for applications ranging from industrial IoT to smart homes and low cost consumer devices. The EC4L10BA1 and EC4L05BA1 offer varying memory capacities and complement the existing EC4L15BA1 model. All three modules feature built-in antenna and support Bluetooth 6.

The modules have multi-protocol support, with support for Bluetooth Low Energy, Thread, and Matter standard. They can also communicate using a proprietary 4Mbps mode.

They leverage a chip with ARM Platform Security Architecture (PSA) certification, enabling secure IoT development. Mass production is set to begin in January 2026.

The modules provide multiple memory options. The EC4L15BA1 (1.5MB NVM/256KB RAM) for advanced use, the EC4L10BA1 (1.0MB NVM/192KB RAM), and the EC4L05BA1 (0.5MB NVM/96KB RAM). They are designed to cater to applications ranging from industrial IoT and healthcare to smart home devices and cost-sensitive, high-volume production.

The modules are designed to simplify development of IoT devices with high-security demands. This is due to a chip supporting PSA Level 3 certification, the highest level in IoT security standards.

They have a built-in antenna and are pre-certified with Radio Law MIC (Japan), FCC (USA), and ISED (Canada), significantly cutting development time and costs. They also support Bluetooth SIG qualification for the latest Bluetooth 6, enabling Channel Sounding for precise distance measurement.