Swiss semiconductor firm ST Microelectronics has launched a compact direct time-of-flight 3D lidar all-in-one module for high-resolution sensing.

The VL53L9 delivers AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across applications in robotics, industrial automation, smart buildings, AR, VR and healthcare.

In robotics, it enhances small object detection, slam (simultaneous localisation and mapping) and obstacle avoidance for autonomous navigation. For industrial automation, it provides accurate volume measurement in tanks and bins, improving operational efficiency and inventory management. Smart buildings and homes get reliable human presence detection and people counting while preserving user privacy. For AR, VR and consumer electronics, it can enable gesture recognition, body tracking and finger skeleton for immersive user experiences. And in healthcare, it can be used for fall detection and monitoring for eldercare and patient safety.

It combines high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module.

“By simplifying integration and reducing system complexity, we enable customers to accelerate the development of applications such as robotics, smart infrastructure and healthcare monitoring,” said Alexandre Balmefrezol, executive vice president at ST Microelectronics (www.st.com). “This launch reflects our strategy to move beyond standalone sensors and deliver integrated sensing systems that support real-world edge AI.”

The VL53L9 has a 2268 resolution zone (54×42) with a 54˚ by 42˚ field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours and edges. Leveraging STM’s proprietary stacked BSI spad sensor technology and metasurface optical elements, the module delivers fast and accurate ranging from less than 5cm up to 9m with up to 1% accuracy and a frame rate of 100 frames per second.

The dual-scan flood illumination replaces traditional dot scanning, reducing motion artefacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infra-red and 3D depth images. This simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module integrates on-chip dToF processing and a dedicated power management IC, and is calibration-free, simplifying integration and reducing system cost and complexity.

Measuring 12.8 by 6.1 by 4.6mm, the reflowable, single-component module is compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 and 3.3V) and outputs data via Mipi or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as class-one laser safe, providing reliable and secure operation for end users.

“3D sensing demand accelerates across robotics, industrial automation, XR and intelligent consumer devices,” said Anas Chalak, analyst at Yole Group (www.yolegroup.com). “Time-of-flight technology is expanding beyond smartphones into applications requiring compact, affordable and precise depth perception, from navigation and people monitoring to gesture recognition and safety. Higher resolution multizone dToF modules are now emerging as key enablers for this next wave of 3D sensing adoption.”

The VL53L9 (www.st.com/en/imaging-and-photonics-solutions/vl53l9cx.html) will be in mass production early next month with samples and volume shipments available globally.