Swiss semiconductor company ST Microelectronics has introduced a family of 5MP CMOS image sensors for vision applications in industrial automation, access control, traffic management and smart retail.

The VD1943, VB1943, VD5943 and VB5943 BrightSense sensors can be used in industrial automation with enhanced machine and robotic vision, security including biometric identification, traffic management, and smart retail applications such as inventory management and automated checkout.

“Our new image sensors with hybrid global and rolling shutter modes allow our customers to optimise image capture, ensuring motion-artefact-free video capture and low-noise, high-detail imaging at the same time, making it ideal for high-speed automated manufacturing processes and object tracking,” said Alexandre Balmefrezol, executive vice president at ST Microelectronics (www.st.com). “This architecture is unique and provides unmatched flexibility, performance and integration. We continue to broaden our portfolio for a wide range of industrial applications and want to bring the best of optical sensing technologies to both existing and new applications.”

The sensors, part of the ST BrightSense (www.st.com/en/imaging-and-photonics-solutions/industrial-consumer-cmos-image-sensors.html) portfolio, are ready for evaluation and sampling, with mass production scheduled to begin in February 2026. Detailed documentation, evaluation kits and product samples are available.

The sensors provide hybrid global and rolling shutter modes, allowing developers to optimise image capture for specific applications. This functionality ensures motion-artefact-free video capture (global shutter) and low-noise, high-detail imaging (rolling shutter), making it suitable for high-speed object tracking and automated manufacturing.

“Industrial and security imaging are pushing sensor performance to new levels, enabling functions from identification to robotic guidance, gauging and advanced monitoring and inspection,” said Florian Domengie, principal analyst at Yole Group (www.yolegroup.com). “By 2030, this image sensor market is projected to reach $3.9bn with over 500 million units shipped. Key advances will include enhanced low-light performance, on-chip intelligence, and hybrid global and rolling shutter operation, combining low noise with high-precision temporal sensing.

Using 2.25µm pixel technology and 3D stacking, the sensors deliver high image quality in a smaller footprint. The die size is 5.76 by 4.46mm, with a package size of 10.3 by 8.9mm, and a 73%-pixel array-to-die surface ratio. This compact design enables integration into space-constrained embedded vision systems without compromising performance.

The RGB-IR variants of the sensors feature on-chip RGB-IR separation, eliminating the need for additional components and simplifying system design. This capability supports multiple output patterns, including 5MP RGB-NIR 4×4, 5MP RGB Bayer, 1.27MP NIR subsampling and 5MP NIR smart upscale, with independent exposure times and instant output pattern switching. This integration reduces costs while maintaining full 5MP resolution for both colour and infra-red imaging.

The sensors incorporate backside illumination (BSI) and capacitive deep trench isolation (CDTI) pixel technologies to enhance sensitivity and sharpness, particularly in low lighting conditions. Single-frame on-chip HDR improves detail visibility across bright and dark areas. These features enable high-quality imaging in difficult environments and support machine vision and edge AI applications.