Sony Semiconductor has launched a cellular LTE-M and NB-IoT chipset to enable additional LPWA communication protocols as well as satellite connectivity (NTN) in a single chipset.

The ALT1350 has an architecture that is said to resolve IoT service providers’ power consumption concerns. Its optimised standby mode (eDRX) reduces power consumption by 80% compared with the current generation and by 85% when using it to send short messages. Overall improvements in the system’s power consumption could enable four times longer battery life for a typical device, enabling additional functionalities and use cases with smaller batteries.

The sub-GHz and 2.4GHz integrated transceiver enables hybrid connectivity for smart meters, smart cities, trackers and other devices. This enhances coverage, reduces costs and further decreases power consumption using IEEE 802.15.4-based protocols, such as Wi-Sun, U-Bus Air, and wM-Bus, in additional point-to-point and mesh technologies.

It incorporates a sensor hub to collect data from the sensors while maintaining low power consumption. It also provides cellular and wifi-based positioning and is integrated to provide power-optimised concurrent LTE and GNSS to accommodate various tracking applications, which can be demanding, with a single chip.

“The market demand for this multiprotocol, ultra-low power IoT chipset is intensifying, and Sony’s ALT1350 chipset meets that demand,” said Nohik Semel, CEO at Sony Semiconductor in Israel. “This is the game changer we’ve been waiting for, which will enable IoT deployments, utilising universal connectivity on edge processing and multiple location technologies”

The chipset is designed to support the wide-ranging market needs of utilities, vehicles, tracking devices, smart cities, connected health and other verticals. Device manufacturers across all verticals can take advantage of its low power consumption, long-lasting battery life, release 15 LTE-M and NB-IoT software stack, and future compatibility with 3GPP release 17 All these are said to guarantee longevity and ensure the device operates with 5G networks. It contains an additional LPWA radio transceiver with targeting operation in sub-GHz and 2.4GHz ISM bands for universal connectivity options.

The chipset provides on-the-edge low-power processing capabilities, ranging from data collection, low-power AI and ML processing of the data, and MCU to enable IoT applications on the chip. Currently, the device is sampling to lead customers and will become commercially available during 2023. It also includes a secure element for application usage and integrated SIM designed for PP-0117 to meet GSMA requirements.