Japanese electronics company Renesas has designed a mixed-signal device for reducing board space in compact products such as smart rings, smartwatches, fitness bands, VR glasses and portable electronics.

The SLG46801 is said to be the industry’s smallest GreenPak configurable mixed-signal device. It comes in WLCSP and STQFN packages. The nine-ball WLCSP measures 1.155 by 1.155mm and includes multi-time programmability.

As consumer devices become smaller and feature-rich, designers need to integrate additional functionality while reducing component count, PCB area and cost. The SLG46801 addresses these requirements by combining commonly used analogue, timing and logic functions in a compact, low-power device that can complement an MCU or replace multiple discrete components.

“Designers are being asked to integrate more functionality into increasingly compact products without increasing system cost or development effort, while also reducing power consumption,” said Jason Kim, vice president at Renesas (www.renesas.com). “The SLG46801 expands our GreenPak portfolio with an ultra-compact WLCSP option and flexible in-system configurability, helping customers create smaller, more feature-rich products and implement updates even after deployment.”

It integrates two high-speed analogue comparators, configurable lookup tables, counters and delays, 10kHz and 25MHz oscillators, voltage-tolerant GPIOs and an I²C-compatible serial interface. These support sensing, control, glue-logic, timing and system housekeeping functions in applications across consumer electronics, handheld devices, smart-home systems, networking and communications, computing and storage, industrial control, and IoT sensor nodes.

It is also available in a 12-lead, 1.6 by 1.6 by 0.55mm STQFN package. The two package options allow users to balance minimum board area with additional GPIO availability and industrial package preferences.

More than four billion GreenPak devices have been shipped worldwide. These ICs let designers combine analogue and digital functions in small, low-power devices that can be configured using the Renesas Go Configure software hub. The free GUI-based development environment helps users develop custom hardware functions without the need for additional discrete components or complex firmware development.

The SLG46801 includes multi-time programmable non-volatile memory that can be configured through its I²C interface. This lets users implement bug fixes, configuration changes and product upgrades after the device has been integrated into the end application, helping reduce redesign cycles and additional hardware revisions.

The device supports operation and programming across the 1.71 to 5.5V supply range. GPIO pins can also be repurposed dynamically for the I²C interface, increasing flexibility in designs with limited pin availability. Optional CRC-8 and read-back protection support more robust and controlled configurable implementations.

The SLG46801 (www.renesas.com/products/slg46801) in the STQFN package is sampling now, with the WLCSP package available at mass production planned for November 2026. Renesas Go Configure software hub (www.renesas.com/en/software-tool/go-configure-software-hub) is available for programming, emulation and simulation.