Napino Tech Ventures and Teksun Microsys have launched a joint venture in India for manufacturing AI and IoT products.

Called Rapidise Technology, it kicks off with $4m in seed funding, aimed at transforming how AI-enabled connected devices are designed, engineered and manufactured at scale.

Rapidise serves as a one-stop original design manufacturer (ODM) for start-ups, SMBs and enterprises developing AI-powered products. As an ODM, Rapidise not only manufactures but also designs, prototypes, certifies and manages the full product lifecycle, enabling customers to focus on branding and market strategy while Rapidise delivers turnkey innovation.

“Rapidise unites best-in-class product engineering with scalable manufacturing to accelerate AIoT innovation,” said Vaibhav Raheja, board director at Rapidise and joint managing director at Napino Auto.

Rapidise integrates product design and engineering expertise from Teksun with Napino’s electronics manufacturing infrastructure in India. This vertical integration supports rapid innovation and high-volume production for sectors such as automotive, healthcare, industrial and consumer electronics.

The company has already delivered over one million smart IoT devices and holds more than $81m in booked orders across North America, Europe, Middle East and Apac.

“Our vision is to be a world-leading ODM player, recognised for innovation, agility and commitment to empowering intelligent, high-performance,” said Brijesh Kamani, CEO of Rapidise. “By combining engineering and manufacturing under one roof, we’re ready to power the next generation of AI-enabled IoT products.”

Headquartered in India, Rapidise operates fully automated, Japanese SMT lines (Class 7 cleanroom), camera module manufacturing (Class 6 cleanroom), AI-powered PCB assembly lines, mechanical tooling, and full box-build assembly infrastructure. This enables the production of complex electronics, including : IoT modules and gateways; camera modules, dash cameras and body-worn cameras; 5G-enabled surveillance systems and automotive edge AI devices; infotainment devices, smart TVs and mobile phones; and smart devices for agri-tech, fin-tech, utilities and Industry 4.0 applications.

With more than 300 R&D engineers and modular, production-ready platforms, Rapidise accelerates custom IoT, AI and connected development. This reduces engineering risk and shortens time to market.

“We’re transforming how products are built from concept to mass production,” said Ashish Chinthal, chief business officer at Rapidise. “Our self-service platform delivers instant quotes for engineering and manufacturing, enabling on-demand ODM services that are faster, more accessible and fully transparent.”

Rapidise (www.rapidise.co) collaborates with semiconductor and connectivity companies to integrate AI, connectivity and edge processing into its platforms. These partnerships accelerate innovation at the intelligent edge, enabling customers to launch connected products faster and at scale.

The company is working with Qualcomm (www.qualcomm.com) to co-develop AI-ready connected products.

“The collaboration showcases how ecosystem partnerships can accelerate scalable AI innovation,” said Manmeet Singh, senior director for Qualcomm in India. “It’s a strong example of India-led co-innovation powering intelligent edge globally.”