MediaTek powers Grinn systems-on-module
- September 24, 2025
- Steve Rogerson

Polish firm Grinn has announced a partnership with Taiwanese semiconductor company MediaTek to implement AI and IoT technologies based on its off-the-shelf embedded computing systems.
The first fruit of the partnership is the creation of a family of systems-on-module (SoMs) based on the MediaTek Genio 700 and 510 application processors. The Grinn GenioSoM-700 and GenioSoM-510, said to be the world’s smallest SoMs based on the Genio platform, support compute workloads, real-time AI operations and high-quality video, display and audio applications.
The partnership with MediaTek also helps Grinn develop innovative and effective custom embedded computing for its customers, enabling it to draw directly on technical support from MediaTek, early access to MediaTek product roadmaps and privileged supply-chain support.
“The solutions that are being brought to life through our partnership with Grinn utilise AI capabilities and advanced connectivity, enabling a wide variety of benefits in the SoM and wireless module space,” said CK Wang, general manager of the IoT business group at MediaTek (www.mediatek.com). “The MediaTek Genio 700 makes it possible for Grinn to effectively address a diverse range of IoT applications and market segments.”
Robert Otręba, CEO of Grinn, added: “At Grinn, we are making the integration of edge AI into end products far less complex for customers. The combination of high-performance computing and low power consumption in our ready-to-use modules means our clients can move from prototyping to deployment much faster. The partnership with MediaTek ensures that innovative AI at the edge is not only more accessible, but also scalable and production-ready from day one.”
The GenioSoM-700 (grinn-global.com/products/grinn-geniosom-700) is for smart home devices, industrial automation equipment and computer vision systems that require high-throughput vision processing and AI acceleration. Based on the Genio 700 processor, it is supplied in an LGA-312 format which has a footprint of 37.0 by 42.6mm.
The processor features dual 2.2GHz Arm Cortex-A78 cores for intensive compute workloads, six 2.0GHz Cortex-A55 cores for efficient multi-tasking, and an Arm Mali-G57 graphics processing unit (GPU) for graphics and smooth image rendering. The MT8390 supports real-time AI operation thanks to an on-chip 4Tops neural processing unit (NPU).
It supports demanding compute and AI workloads in machine vision and audio applications, and combines high-speed interfaces, image signal processing and video codecs.
The GenioSoM-510 (grinn-global.com/products/grinn-geniosom-510) has dual 2.2GHz Arm Cortex-A78 cores and four Cortex-A55 cores. It also features an on-chip NPU.
The Grinn GenioEVB (grinn-global.com/products/grinn-genioevb) gives developers a versatile evaluation platform for the GenioSoM modules. Featuring a range of headers, the GenioEVB ensures effortless integration of sensors and modules with GenioSoM products. It serves as a reference for developers, streamlining the creation of schematics and PCB layouts for product development.
The modules and development platform are available to order online from grinn-global.com.

