Engineered to meet the rigorous footprint and reliability demands of satellite, cellular and broadband wireless systems, low-ESR capacitors from KYOCERA AVX deliver stability across an expanded range of small sizes.

The firm has added an ultra-miniature 0201 case size to its KGU series of low-ESR C0G (NP0) RF multilayer ceramic chip capacitors (MLCCs) to serve the evolving needs of the communications industry.

Driven by continuous demand for compact components that deliver repeatable RF performance in critical high-frequency circuitry, the field-proven KGU series now offers a robust suite of RF advantages in five miniature and ultra-miniature EIA chip sizes: 01005, 0201, 0402, 0603 and 0805.

The stable Class I C0G (NP0) ceramic dielectrics exhibit a temperature coefficient of capacitance of 0±30ppm/˚C and virtually zero voltage coefficient. Base metal electrodes made of tin/nickel-plated copper deliver high electrical conductivity, high capacitance-voltage capabilities in tight spaces, and solderability. Low equivalent series resistance (ESR), high power handling, high Q and high self-resonant frequencies (SRF) combine with tight tolerances to reduce signal loss and enable precise frequency control.

Inherent immunity to aging and microphonics enables clean signal performance over long operating lifetimes. Thermal and mechanical resilience effectively eliminates assembly risks such as cracking and tombstoning to help OEMs increase production yields.

The expanded range is rated for 6.3 to 250V, 0.1 to 100pF with tolerances as low as ±0.05pF, and operating temperatures from -55 to +125˚C.

Applications include bypass, coupling, DC blocking, matching and filter networks, tuning circuits, and high-Q frequency sources in subscriber-based wireless devices, 802.11 wifi networks, cellular basestations, broadband wireless platforms, satellite communications and public safety radio systems.

The series (www.kyocera-avx.com/products/rfmicrowave/capacitors/kgu-series-rf-ceramic-caps/) is fully RoHS compliant and is supplied in standard tape-and-reel packaging for seamless integration into high-speed, high-volume automated manufacturing lines and existing PCB layouts.

“Next-generation RF architectures for satellite communications and high-density wireless networks are challenging design engineers to minimise their physical footprints without compromising signal integrity or power handling,” said Mohammed Abu-Naim, RF product marketing manager at KYOCERA AVX (www.kyocera-avx.com). “Our new ultraminiature 0201 KGU series MLCCs are expressly designed to solve this problem. By delivering exceptionally low ESR, high Q and high repeatability in a sub-millimetre form factor based on rigorously tested technology backed by years of field-proven performance, the new 0201 KGU MLCCs enable RF engineers to aggressively downsize their designs without risking circuit detuning or manufacturing defects.”