German electronics company Infineon has produced a microcontroller that integrates Wifi 6 and 6E and Bluetooth LE 5.4 for smart home, industrial, wearables and other IoT applications.

The Airoc CYW5591x connected microcontroller (MCU) helps users build cost-optimised, power-efficient, small form-factor products for IoT applications. The flexible platform accelerates customers’ time-to-market with ModusToolbox software, RTOS and Linux host drivers, a validated Bluetooth stack and multiple sample code examples, Matter software enablement, and support for Infineon’s worldwide partner network.

“As an IoT leader with more than a billion wifi devices deployed worldwide, Infineon is committed to driving decarbonisation and digitalisation with low-power options that connect products to the cloud,” said Sivaram Trikutam, vice president at Infineon (www.infineon.com). “The combination of our easy-to-use software, along with industry’s best wireless performance and lowest power consumption allows best-in-class IoT products to be built using the Airoc CYW5591x connected MCU family.”

This device can be used as the main processor in an IoT device or as a subsystem in more complex designs to offload connectivity for IoT applications. The product family is available in three versions: CYW55913 for tri-band (2.4/5/6GHz), CYW55912 for dual-band (2.4/5GHz), and CYW55911 for single-band (2.4GHz) support.

The device includes an Arm Cortex M33 192MHz MCU with TrustZone CC312 with 768kbyte SRAM.

The CYW55913/2/1 (www.infineon.com/cms/en/product/wireless-connectivity/airoc-connected-mcu/cyw55913) is sampling now to alpha customers.

“As a leading provider of wireless connectivity, we are excited to partner with industry-leader Infineon Technologies on their new Airoc CYW551x wifi and Bluetooth family in several of our new wifi modules,” said Patrick Lin, vice president at AzureWave (www.azurewave.com). “Our new ultra-small wireless modules with Infineon’s secured and robust components, deliver seamless connectivity for personal and industrial devices including mobile and internet devices, consumer electronics, home appliances, and more for tomorrow’s smart, connected requirements.”

Masatomo Hashimoto, director at Murata (www.murata.com), added: “We are excited to partner with Infineon on its new, innovative Airoc CYW5591x wifi and Bluetooth connected MCU family. Our latest wifi modules with the new Infineon Wifi 6 SoC, along with its easy-to-use software development platform, simplify wireless development and certification for a variety of smart, connected devices. We look forward to enabling more developers to bring seamless connectivity in various form-factors to market.”

And Mason Lin, senior vice president at USI (www.usiglobal.com), said: “With a track record of shipping over five billion modules and boasting over two decades of industry experience, we are extremely pleased to partner with Infineon on their latest MCU family. The combination of Infineon’s new chips in our miniaturised wifi-Bluetooth combo modules not only expedites time-to-market but also empowers developers to swiftly introduce portable consumer, smart home and industrial applications to a wider audience.”