An LTE Cat.1 bis module from Fibocom can provide IoT devices with single-SKU global connectivity.

The LE271-GL has a compact size, global frequency coverage, low power consumption and compatibility to offers a cost-effective 4G option for worldwide IoT applications such as asset tracking, IP cameras, new energy systems and consumer electronics.

Measuring 17.7 by 15.8mm, it is pin-to-pin compatible with the firm’s MC661, LE270 and LE37X series, as well as other modules of similar packaging. Users can migrate without changing PCB designs. Supporting both FDD-LTE and TDD-LTE bands, the module covers all major global frequencies under a single SKU, simplifying inventory management and reducing logistics costs for international deployment.

The module ensures quick and stable connections, achieving network registration in under 3.5s. Optimised AT command response and USB enumeration improve device start-up and connectivity efficiency. Its OpenCPU architecture provides flexibility for secondary development, lowering overall device costs.

For battery-powered applications, the module achieves microamp-level sleep current and supports DRX and other low-power modes. Interfaces including VDD_EXT and multiple GPIOs remain powered in standby, ensuring long battery life while maintaining critical functionality.

It supports LBS plus wifi scan positioning for indoor and international use, eSIM, and single and dual-SIM configurations. It integrates USB, uart, SPI, I²C, ADC, LCD, camera and GPIO interfaces, and supports TTS, MQTT, HTTP and SSL protocols for versatile IoT applications.

Now in the engineering sample stage, it is said to set a benchmark for global Cat.1 bis connectivity, enabling users and partners worldwide to explore opportunities in the IoT market.

Fibocom (www.fibocom.com), founded in 1999, is China’s first wireless communication module company listed on both the A-share and H-share markets. As a provider of wireless communication modules and AI products, it leverages wireless communications and artificial intelligence as its core technologies to provide integrated hardware and software for industrial applications.