German embedded computing firm Congatec has introduced a computer-on-module (CoM) for cost-sensitive edge AI applications in markets such as robotics, industrial automation, medical technology, transportation, smart cities and retail point-of-sale (PoS).

The Conga-TC300 CoM in the Com Express Compact form factor is based on Intel Core Series 3 processors, codenamed Wildcat Lake. With this, the application-ready AReady CoMs bring dedicated AI accelerators to the low-power and entry-level segment of x86-based embedded and industrial edge applications.

They are a suitable upgrade for embedded designs that previously used Intel Atom or Celeron platforms but now need to expand with dedicated AI capabilities.

With the Intel Core Series 3 processors, the modules bring numerous high-end features to the entry-level segment. These include improved energy efficiency thanks to two performance cores (P-cores) and four low-power efficient cores (LP E-cores), which deliver up to 5Tops. They are also the first Intel Core modules with a dedicated NPU capable of up to 18Tops. In addition, there are up to two Xe3 graphics cores for GPGPU-accelerated AI applications, also delivering up to 18Tops.

In total, developers can access up to 41Tops of AI performance within a thermal design power (TDP) envelope that can be scaled from 12 to 28W with a 15W base TDP to suit various use cases.

“With the Conga-TC300, we are opening up a reliable upgrade path to new AI capabilities with up to ten years of availability for low-power and lightweight AI applications,” said Jürgen Jungbauer, senior product line manager at Congatec (www.congatec.com). “With our new Com Express module, OEMs can easily equip applications such as autonomous guided vehicles and autonomous mobile robots, intelligent machine controls, HMIs, patient data monitoring systems, surveillance, or check-in and check-out terminals with new AI features. Whether it’s local voice or gesture control, AI-assisted object recognition and identification, or LLM-based dialogue functions, developers looking for cost- and energy-efficient AI performance will be very pleased with the Conga-TC300.”

The module integrates up to 64Gbyte of DDR memory with speeds of up to 6400MT/s and optional in-band error correction code (IBECC). Up to 512Gbyte of onboard UFS 3.1 storage is available as an option. Networked applications benefit from 2.5Gbit Ethernet, optionally with time-coordinated computing (TCC) and time-sensitive networking (TSN). Up to eight freely configurable PCIe lanes are available for fast data transfer and the connection of low-lane peripherals such as Ethernet, Fieldbus adapters or wireless modules. This eliminates the need for an additional PCIe switch on the carrier board, further simplifying the design.

Up to two DDI ports, one LVDS port or one eDP port are available for connecting displays. Additional interfaces include up to two USB4, four USB3.2, four USB2.0, two Sata, two uart, GPIOs, GP SPI, eSPI, SM Bus, HDA and I²C.

On the software side, Congatec supports users with a board management controller, multi-stage watchdog and various embedded bios features. A trusted patform module (TPM 2.0) ensures the necessary security.

Supported operating systems include Microsoft Windows 11, Windows 11 IoT Enterprise and Linux. As application-ready AReady CoMs, the modules are available preconfigured with licensed CtrlX OS, Ubuntu Pro and KontronOS operating systems. The AReady.VT option, featuring integrated Conga-Zones hypervisor and virtualisation technologies, enables developers to consolidate multiple workloads such as real-time control, HMI, AI and IoT gateway functions on a single module.

For IIoT connectivity, Congatec offers AReady.IoT software building blocks. As Conga-Connect, they enable data exchange, remote maintenance and management of the module, carrier boards and peripherals, as well as cloud connectivity, as needed.

To simplify application development, a supporting ecosystem includes evaluation and application carrier boards, customised cooling, documentation, design-in services and high-speed signal integrity measurements. With AReady.Yours, OEMs can also take advantage of Congatec’s hardware and software customisation services to obtain turnkey-level embedded computing platforms, including cooling.

Further information on the Conga-TC300 CoM can be found at www.congatec.com/en/products/com-express-type-6/conga-tc300.