IMC Newsdesk

Congatec Intel-powered modules target AI-based IoT

  • January 14, 2026
  • Steve Rogerson

German edge computing firm Congatec has launched computers-on-module (CoMs) based on Intel Core Ultra Series 3 processors for in AI applications in industrial automation, robotics, smart cities, transportation, healthcare and retail point-of-sale.

The modules deliver up to 180Tops of power-efficient computation for AI acceleration. In most scenarios, the modules’ processing capability means discrete accelerator cards will not be necessary for embedded AI applications.

Five CoMs across four form factors leverage the heterogeneous core architecture of the Intel processors to enable local natural language processing (NLP), large language model (LLM) execution, image classification, sensor fusion, and simultaneous localisation and mapping (slam) in new and existing designs.

They offer up to 16 cores with up to 10Tops, feature an integrated NPU5 for low-power AI inference with up to 50Tops, and can replace discrete AI accelerators with up to 12 Xe3 cores with up to 120Tops.

Size, weight and power (SWaP) optimised small form factor designs are best served with the Com Express Mini and Com-HPC Mini modules. Existing Com Express applications benefit from two different Com Express Compact modules optimised for either rugged or cost. New applications requiring uncompromised performance and IO bandwidth can leverage the Com-HPC Client module.

“We see an immense demand for ever-increasing computing and AI performance at the edge,” said Konrad Garhammer, CTO at Congatec. “Existing applications also require upgrades. The acquisition of Kontron’s module business enables us to provide the market with the largest portfolio of Intel Core Ultra Series 3-based modules. We cover the entire range, from small form factor with Com-HPC Mini and Com Express Type 10 to absolutely high-performance optimised Com Express and Com-HPC Client designs.”

Michael Masci, vice president at Intel (www.intel.com), added: “Intel Core Ultra Series 3 processors mark a major inflection point in embedded systems development. System designers can take full advantage of integrated AI on embedded targets without needing a separate AI accelerator. That represents a tremendous leap in computing power and in AI performance for all types of embedded applications with long-lifecycle and high-reliability requirements. It’s also ideally suited to size, weight, power and cost-optimised designs.”

For new designs requiring the highest data-throughput with PCIe Gen 5 and USB4, the Com-HPC Mini Conga-HPC/mPTL and Com-HPC Client Conga-HPC/cPTL modules deliver extreme performance and IO bandwidth. For existing Com Express Type 10-based mission-critical applications the credit-card sized Conga-MC1000 is a suitable upgrade. The Conga-TC1000 Com Express Compact module targets legacy cost-sensitive systems in need of technology refresh, and the ruggedised Conga-TC1000r with screw-locked LPCAMM2 memory is aimed at rugged applications.

All the modules are powered by the Ultra Series 3 processors, built on Intel 18A, and can scale up to Core Ultra X9 or X7 processors with up to four P-cores, up to eight E-cores and up to four LP E-Cores. Designers can work with up to 96Gbyte of soldered-down LPPDR5X memory or socketed LPCAMM2 memory on selected SKUs with optional in-band ECC for mission-critical applications. The integrated graphics with Intel Xe-Display-Engine support up to three independent 6K displays.

Supported operating systems include Microsoft Windows 11, Windows 11 IoT Enterprise, CtrlX OS, Ubuntu Pro, Kontron OS, Linux and Yocto. The aReady.VT option with integrated hypervisor-on-module allows developers to consolidate multiple workloads, such as real-time control, HMI, AI and IoT gateway functions on a single module.

For IIoT connectivity, Congatec offers its aReady.IoT software building blocks, which enable data exchange, maintenance and management of the module, carrier and peripherals, as well as cloud connectivity upon request. To simplify application development, the ecosystem includes evaluation and production-ready carrier boards, customised cooling options, documentation, design-in services and high-speed signal integrity measurements.

“For too long, designers have faced an undesirable tradeoff – get the performance required for embedded AI and pay the power penalty, then manage the size and cost constraints that come with a discrete AI accelerator or sacrifice edge AI capability to meet application constraints,” said Martin Danzer, director of product management at Congatec (www.congatec.com). “Congatec’s extensive portfolio of CoMs for Intel Core Ultra Series 3 processors changes the game entirely. Designers can get the embedded AI performance they need in the form factor they require.”

For more information on the CoMs, visit: