Dassault Systèmes and Silvaco Group have partnered to develop interoperable digital twin workflows for semiconductor manufacturing.

The collaboration connects Dassault Systèmes’ SIMULIA plasma simulation applications with Silvaco’s Victory Process feature-scale modelling software. The integrated workflow is designed to allow semiconductor manufacturers to analyse how specific equipment conditions influence wafer-level structural outcomes during advanced etch and deposition processes.

The partnership also enables the transfer of material and structural data from Silvaco’s process simulations into Dassault’s structural analysis environments. This allows engineers to conduct stress and deformation analyses, which are critical for developing complex, narrow-window device architectures.

The companies aim to reduce manual data handoffs and physical experimentation in fabrication facilities, accelerating the industry’s shift toward predictive, data-driven engineering.

“By combining Silvaco’s expertise in feature-scale semiconductor process simulation with Dassault Systèmes’ SIMULIA leadership in multiphysics simulation, we believe this partnership can help customers move closer to first-time-right manufacturing,” Walden C. Rhines, Chief Executive Officer of Silvaco, said.